Suject Ref.:  The 4-Layer PCB Architecture for the 32-Segment Bipolar Commutator Driver

@ All and dear friend Ufolpolitics,

After studying Ufopolitics' latest commutator developments and the newly proposed annular PCB concept, I have produced a new engineering rendering showing a possible 4-Layer PCB implementation for the 32-Segment Bipolar Commutator Driver.
The objective of this design is to replace the large number of individual interconnecting wires with a robust multilayer PCB architecture that can be directly mounted to the stationary commutator assembly.
Why a 4-Layer PCB?
As many of you have seen from Ufopolitics' original 32-segment dual-polarity diagrams, the routing becomes extremely complex due to the large number of crossing connections required to create the eight final output groups.
A single-layer board is simply not practical.
Even a two-layer board becomes heavily congested once all 32 segment connections are routed.
The proposed solution is a 4-layer heavy-copper PCB, organized as follows:
IMAGE:

Suject Ref.:  The 4-Layer PCB Architecture for the 32-Segment Bipolar Commutator Driver
@ All and dear friend Ufolpolitics,
After studying Ufopolitics' latest commutator developments and the newly proposed annular PCB concept, I have produced a new engineering rendering showing a possible 4-Layer PCB implementation for the 32-Segment Bipolar Commutator Driver.
The objective of this design is to replace the large number of individual interconnecting wires with a robust multilayer PCB architecture that can be directly mounted to the stationary commutator assembly.
Why a 4-Layer PCB?
As many of you have seen from Ufopolitics' original 32-segment dual-polarity diagrams, the routing becomes extremely complex due to the large number of crossing connections required to create the eight final output groups.
A single-layer board is simply not practical.
Even a two-layer board becomes heavily congested once all 32 segment connections are routed.
The proposed solution is a 4-layer heavy-copper PCB, organized as follows:
IMAGE:

Layer 1 – Segment Routing

• Receives the 32 individual commutator segment inputs.
• Routes signals from each copper segment.
• Primary signal distribution layer.

Layer 2 – Reinforced Bus Paths

• Heavy copper power distribution layer.
• Low-resistance current paths.
• Designed to carry substantially more current than required.

Layer 3 – Return / Group Routing

• Internal routing layer for grouping and sequence connections.
• Reduces congestion and crossover complexity.
• Improves overall routing efficiency.

Layer 4 – Output Pads

• Eight final output terminals.
• Large copper pads for reliable external connections.
• Simplifies wiring to the sequential excitation coils.

Proposed Electrical Design Margin
Although the current target is approximately:

• 200 V maximum
• 2 A maximum

The PCB has been intentionally oversized for reliability:

• Design Voltage: 300–400 V DC
• Continuous Current Rating: 5 A
• Heavy Copper Construction
• Large Conductors
• Multiple Through-Hole Vias
• High Creepage and Clearance Distances

This approach provides a significant safety margin and should improve long-term durability.
Mechanical Considerations
The PCB ring is designed to bolt directly to the stationary commutator assembly.
Features include:

• Large plated-through mounting holes
• Reinforced copper pads
• Mechanical strain relief
• Vibration-resistant construction
• Conformal coating compatibility
• Industrial-grade FR4 material

The design should be capable of withstanding vibration, brush dust contamination, and long-duration operation.
Advantages of the PCB Approach
Compared with hand wiring:
✔ Cleaner construction
✔ Repeatable manufacturing
✔ Reduced assembly time
✔ Lower wiring errors
✔ Improved reliability
✔ Easier replication by future builders
✔ Better documentation and standardization
Important Note
This rendering should be considered an engineering concept intended to visualize how the routing could be implemented.
Before final manufacturing drawings are produced, several dimensions still need to be finalized, including:

• Exact commutator segment geometry
• Segment insulation spacing
• Brush width
• Copper thickness
• Mounting hole pattern
• Final PCB stack-up

However, I believe this direction offers a very practical path toward converting the original wiring scheme into a manufacturable and repeatable assembly.
Many thanks to Ufopolitics for continuing to share the developments and the underlying commutation logic that made this visualization possible.

Best regards, Alex (user: kampen)

Hello All,

Hello dear friend @kampen

Ok, please about this Post: I HIGHLY RECOMMEND TO WATCH VIDEO FIRST!!

As the Video will explain much better what I have done here:



So, before this FINAL DESIGN, I had a "MIX" on the Output Connectors Circuit, or a "FLAW" on Design Simplicity to be understood.

• I had previously Output Connector #1 on Front Face ONLY
• As the rest: 2,3,4,5,6,7,8, on the Back side of PCB. (Not a 'UNIFORM' Design Circuit, tends to Confusion).
• Now I have ALL Output Circuit Connectors on the BACK SIDE of PCB.
• Before I had Connector #8 NOT being part of the rest of Connectors between Upper Hemisphere to Lower Hemisphere.
• NOW, Connector from 8_8 to 8_8 is together with the rest...
• Better Grouping.
• Resuming ALL CIRCUITS in THREE (3) GROUPS
• UPPER FRONT FACE PCB CIRCUIT (Two Hemispheres (Two Quadrants on Each Hemisphere) SEPARATED by a MIRROR Imaging, with AXIS 1-1 to 1-1.
• LOWER CIRCUITS:
• Joining the Previous Two Hemispheres (Axis 1-1 to 1-1)
• Plus ALL OUTPUT CIRCUIT Connectors aligned [1 to 8]

So here is the:

So, like I wrote previously, as I said on Video...

• On Upper PCB (FRONT FACE) we ONLY have:
• A MIRROR CIRCUIT OF TWO HEMISPHERES (Center based on AXIS 1-1 [12:00 O'Clock] TO 1-1 [6:00 O'Clock])
• Where each Circuit Comprehends TWO QUADRANTS.
• And it includes connectors from #2 to #8.
• Number 1_1 (at 12) and 1-1 (at 6) Connectors are ONLY joint here On Upper & Lower Hemisphere.
• NOT JOINT between AXIS 9:00 O'Clock [8_8] and 3:00 O'Clock [8_8]

And the:




So, as we can see on above Image...We have now a MUCH CLEANER DESIGN:

• On the LEFT SIDE OF IMAGE, we have the:
• Joining Circuit between BOTH Previous HEMISPHERES based on AXIS 1-1 to 1-1 (12 to 6)
• Including the Output from Connector #1.
• Also including the Output Connector # 8.
• Plus ALL the rest of OUTPUT CONNECTORS.
• Which are now from #1 to #8 OUTPUT CONNECTORS.

THEREFORE, We now have BASICALLY:

THREE MAIN CIRCUITS:

• UPPER FACE OF PCB CIRCUIT (MIRRORED BASED ON AXIS 1-1 [12] TO 1-1 [6])
• ON BACK OF PCB: LOWER CIRCUIT #2 JOINING BOTH PREVIOUS HEMISPHERES
• AND...OUTPUT CIRCUIT TO COILS CONNECTORS.

This would be MY FINAL DESIGN, as I now consider it is very well Organized -As much easier to understand- into Three Main Circuits, where One is on Front, Upper Face of PCB, and the other TWO (2) Circuits on the BACK SIDE of PCB.

From here I will make my FINAL 2D CAD based only on TWO CAD's (Front & Lower PCB Faces)

As a BLEND (SUPERPOSITION)  of the TWO FACE CIRCUITS together.

Regards to All.

Ufopolitics

PD: EDIT 1: You guys have NO IDEA, How much work I had to put into making ALL THESE TRANSFORMATIONS from Primary Circuit to this FINAL VERSION...Unless You have worked with MAYA 3D CAD Software.

Hello again,

Ok, so here are some Transparencies of different views of the NEW PCB DESIGN:




Regards


Ufopolitics

Replying to Message # 812

@ All and dear friend Ufopolitics,

After reviewing Ufopolitics' latest PCB layout and the two images, I think this is a significant improvement over the earlier versions.

From a PCB engineering and manufacturability perspective, the design is becoming much cleaner and more practical.
What Changed?
The earlier concept effectively had:

• Upper hemisphere routing
• Lower hemisphere routing
• Multiple crossover paths
• Many inter-layer transitions

The new concept reorganizes the board into:
Circuit 1 — Front Side
The primary annular routing around the commutator segments.
Circuit 2 — Rear Side
The hemisphere-joining circuit that links what were previously two separate halves.
Circuit 3 — Rear Side
The output collection bus routing to Outputs 1–8.
This is a much more logical partitioning.

---

Engineering Assessment
1. Much Less Congestion
One thing I immediately like is that the routing density around the output connector region is substantially reduced.
Before:

• Many traces converged in one location.
• More chances of routing errors.
• More difficult visual verification.

Now:

• The output bus is isolated.
• Routing is easier to inspect.
• Fewer opportunities for manufacturing mistakes.

Result: Better reliability.

---

2. Easier Continuity Testing
This is perhaps the biggest practical improvement.
Now you can verify:
Output 1 → all four "1" positions
Output 2 → all four "2" positions
...
Output 8 → all four "8" positions
with very little ambiguity.
Builders will immediately understand what they are testing.

---

3. Better for Future CAD Conversion
If Guido (my staff member) eventually converts this into:

• Altium
• KiCad
• Fusion Electronics
• SolidWorks PCB

the cleaner separation of functions makes the PCB easier to recreate.
The design now follows a more traditional PCB hierarchy:
Layer A:
Segment Routing

Layer B:
Hemisphere Join Routing

Layer B:
Output Collection Routing

instead of having everything intertwined.

---

4. Lower Risk of Routing Errors
The previous design required many more crossings and route interactions.
Now most connections are:
Segment
   ↓
Group Number
   ↓
Output Bus
   ↓
Connector

which is easier to audit.
This is exactly how I'd want to document the final manufacturing package.

---

One Suggestion I Would Still Make
I would strongly consider adding a silkscreen reference:
Q1
Q2
Q3
Q4

on the PCB.
Even if the quadrants are already obvious from the circuit logic.
Reason:
Later, when someone is troubleshooting:

• Brush position
• Rotation direction
• CW/CCW testing
• Sequential output testing

they can immediately identify:
Quadrant I
Quadrant II
Quadrant III
Quadrant IV

without opening drawings.
This costs nothing in manufacturing and helps enormously during assembly.

---

Another Suggestion
Since this appears to be the final topology, I would define the via strategy now:
Signal vias
Normal plated-through vias:

• 0.8 mm finished hole
• 1.6–2.0 mm pad

Reinforced current vias
Where group outputs combine:

• 1.5–2.0 mm hole
• Accept 14–16 AWG copper wire
• Solder top and bottom

This follows exactly the Option B approach you and Ufopolitics discussed.

---

Overall Verdict
If I were reviewing this as a design engineer before CAD release, I would say:
✅ Cleaner than previous versions
✅ Easier to understand
✅ Easier to manufacture
✅ Easier to continuity-test
✅ Easier to document
✅ Better suited for hobbyist replication
✅ Consistent with Ufopolitics' goal of making the design accessible to non-engineers
I would consider this layout mature enough to move into a formal KiCad/Altium manufacturing PCB design phase, while simultaneously preparing the mechanical CAD package for the 32-segment commutator assembly.

Kind regards, Alex